HYBRID EVENT: You can participate in person at Seoul, South Korea or Virtually from your home or work
Scholars Forum Listener Registration

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 27)

10th - 11th March 2027 Seoul, South Korea
Hybrid Access Invitation Support

Join researchers, academicians, professionals, and industry experts from around the world to exchange knowledge, engage in academic discussions, and advance solutions for a sustainable future.

Academic Participation Experience

Engage in high-quality sessions, gain insights from domain experts, and be part of meaningful academic discussions.

Official Invitation Letter Available

Registered listeners can request an official invitation letter after successful registration confirmation.

Benefits of Registering as Listener
Access to All Conference Sessions

Attend keynote, plenary and technical sessions across relevant tracks.

Networking Opportunities

Connect with global researchers, professionals and domain experts.

Certificate of Participation

Receive an official participation certificate after successful attendance.

Invitation Support

Request invitation letter support after confirmed registration.

Conference Materials

Access available abstracts, session resources and digital materials.

Expert Insights

Gain knowledge from leading speakers and field specialists.

2 Participant Details
Apply
4 Terms & Condition
Conference Programme and Participation Policy:

The Organiser may create shared sessions for research themes spanning more than one discipline, enabling participants to exchange knowledge, build professional relationships, and identify new opportunities for academic cooperation.

Refund, Cancellation, Postponement, Travel and Transfer of Registration:
Refund Policy:

If the registrant is unable to attend and is not in a position to transfer his/her participation to another person or event, then the following refund arrangements apply: Keeping given advance payments towards Venue, Printing, Shipping, Hotels, and other overheads, we had to keep the Refund Policy as the following slabs:

1. Cancellations made before 60 days of the conference are eligible for a full refund, subject to a $100 cancellation charge.
2. Cancellations made within 60-30 days of the conference are eligible for a 50% payment refund.
3. Cancellations made within 30 days of the conference are not eligible for a refund.
4. Virtual Participation registrations are non-refundable.

(a) The above refund policies are applicable only if the registrant has not received the official invitation letter for participation in the event, If the client receives the conference invitation letter but cannot attend the conference, no refund will be provided.

(b) If the client cannot attend the conference for any personal reasons, the registration fee is not refundable. However, the fee will be considered as a credit to participate in any of our international conferences within one year from the date of registration.

(c) In the event of a visa denial, travel reasons, or natural calamities preventing attendance, the registration fee will not be refunded. However, the fee will be considered as a credit to participate in any of our international conferences within one year from the date of registration.

(d) Since this conference is hybrid, the organizer reserves the right to conduct it in any format, physical or virtual. Refunds will not be provided for format changes.

(e) For participants who register close to the conference date or after the standard registration deadline, The registration will be considered for virtual participation only, as the conference is in hybrid mode. However, you will be eligible to attend one more international conference based on your registration category.

Cancellation Policy:

If the organizer cancels this event for any reason, you will receive a credit for 100% of the registration fee paid. You may use this credit for another event which must occur within one year from the date of cancellation.

Postponement of Event:

If the organizer postpones an event for any reason and you are unable or unwilling to attend on rescheduled dates, you will receive a credit for 100% of the registration fee paid. You may use this credit for another event which must occur within one year from the date of postponement.

Travel and Accommodation Responsibilities:

a) The responsibility for making and managing travel arrangements, including flights, transportation, and accommodation, lies solely with the individual participant.

b) In the event of any changes to the conference format, cancellation, or venue adjustments, the organizers cannot assume responsibility for any costs incurred by participants for travel or accommodation.

Transfer of registration:

All fully paid registrations are transferable to other persons from the same organization if the registered person is unable to attend the event. Transfers must be made by the registered person in writing to [email protected]. Details must include the full name of the replacement person, their title, contact phone number, and email address. All other registration details will be assigned to the new person unless otherwise specified. Registration can be transferred from one conference to another conference of the same organizer if the registrant is unable to attend one of the conferences

However, Registration cannot be transferred if it is intimated within 14 days of the respective conference. The transferred registrations will not be eligible for Refund.

Visa Information:

The organizer will not directly contact embassies and consulates on behalf of visa applicants. All delegates or invitees should take responsibility for their visa and travel arrangements. Important note for failed visa applications: Visa issues cannot come under the consideration of the cancellation policy of the organizer, including the inability to obtain a visa.

N.B:

All cancellations or modifications of registration must be made in writing to [email protected]

I agree and accept the Terms and Conditions of the website https://scholarsforum.net/

Conference Session Tracks

Aligned with United Nations Sustainable Development Goals

Our conference tracks support global knowledge exchange, innovation, and sustainable development priorities across diverse disciplines.

SDG 7 SDG 9 SDG 11 SDG 12 SDG 13
01 Advancements in PCB Design and Fabrication
This track focuses on innovative techniques and methodologies in printed circuit board (PCB) design and fabrication. Participants will explore the latest trends in materials, processes, and technologies that enhance PCB performance and reliability.
02 Microelectronics and VLSI Design Innovations
This session will delve into the cutting-edge developments in microelectronics and Very Large Scale Integration (VLSI) design. Researchers will present their findings on design methodologies, circuit optimization, and integration techniques that push the boundaries of miniaturization and performance.
03 Embedded Systems: Challenges and Solutions
Focusing on the complexities of embedded systems, this track will address the latest research in design, implementation, and optimization. Topics will include real-time systems, software-hardware co-design, and the integration of IoT technologies.
04 Signal Processing Techniques for Electronics Engineering
This session will explore advanced signal processing techniques applicable to various domains within electronics engineering. Contributions will cover algorithms, hardware implementations, and applications in communications, imaging, and control systems.
05 Control Systems: Theory and Applications
This track will examine the latest theoretical advancements and practical applications in control systems engineering. Participants will discuss topics such as feedback control, adaptive systems, and the integration of AI in control strategies.
06 Power Electronics: Innovations and Applications
This session will highlight recent innovations in power electronics, focusing on device technologies, circuit topologies, and applications in renewable energy systems. Researchers will present their work on efficiency improvements and reliability enhancements.
07 Thermal Management in Electronics Packaging
This track addresses the critical aspects of thermal management in electronics packaging and assembly. Discussions will include modeling techniques, materials selection, and innovative cooling solutions to ensure system reliability and performance.
08 Computational Modeling in Electronics Engineering
Focusing on computational modeling techniques, this session will cover simulations and analytical methods used in electronics engineering. Topics will include finite element analysis, computational fluid dynamics, and their applications in design and testing.
09 Energy Efficiency in Electronics Systems
This track will explore strategies for enhancing energy efficiency in electronic systems and devices. Researchers will present methodologies for energy management, optimization techniques, and the role of energy materials in system performance.
10 Testing and Verification in Electronics Engineering
This session will focus on the latest methodologies and technologies for testing and verification in electronics engineering. Topics will include design for testability, fault detection, and reliability assessment in complex electronic systems.
11 Hardware Optimization and Device Fabrication Techniques
This track will cover the latest advancements in hardware optimization and device fabrication techniques. Participants will discuss novel approaches to enhance performance, reduce costs, and improve manufacturability in electronic devices.